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Kingston HX313C9F*K2/8
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Number of votes: 0
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Workmanship
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Technical specifications and characteristics
General characteristics Memory type: DDR3; Form factor: DIMM 240-pin; Clock frequency: 1333 MHz; Volume: 2 module 4 GB; Support ECC: no; Buffered (Registered): no; Low Profile (Low Profile): no; Timings CAS Latency (CL): 9; RAS to CAS Delay (tRCD): 9; Row Precharge Delay (tRP): 9; Advanced The number of chips of each module: 8, one-way packaging; Supply voltage: 1.5 In; Radiator: yes; The number of ranks: 1; Additional information: HX313C9FRK2/8 - radiators red, HX313C9FWK2/8 - radiators white, HX313C9FK2/8 - radiators blue HX313C9FBK2/8 - radiators black;
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Kingston HX313C9F*K2/8 pictures
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Popular today
| | - 1 DDR2 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- CAS Latency (CL): 6
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| | - 2 module DDR2 memory
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- radiator for additional cooling
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| | - 6 DDR3
- the volume of module 4 GB
- form factor DIMM 240-pin
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- radiator for additional cooling
- CAS Latency (CL): 9
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Similar Memory modules
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Brief specs
- 1 DDR3 memory module
- the volume of module 8 GB
- form factor DIMM 240-pin
- the 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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Brief specs
- 1 DDR3 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- the 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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Brief specs
- 2 DDR3
- the volume of module 8 GB
- form factor DIMM 240-pin
- the 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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