Silicon Power
Memory modules
Silicon Power SP512MBSRU533O02
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Silicon Power SP512MBSRU533O02
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Tech characteristics and specs
General characteristics Memory type: DDR2; Form factor: SODIMM 200-pin; Clock frequency: 533 MHz; Bandwidth: 4200 MB/s; Volume: 1 module 512 MB; ECC support: no; UN-Buffered Memory (Registered): no; Low Profile Bracket (Low Profile): no; Timings CAS Latency (CL): 5; RAS to CAS Delay (tRCD): 5; Row Precharge Delay (tRP): 5; Additionally The number of chips of each module: 8; Supply voltage: 1.8 In;
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Popular today
| | - 1 DDR2 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- CAS Latency (CL): 6
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| | - 2 module DDR2 memory
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| | - 6 DDR3
- the volume of module 4 GB
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- frequency 1600 MHz
- radiator for additional cooling
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Brief specs
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Brief specs
- 1 DDR3 memory module
- the volume of module 4 GB
- form factor SODIMM, 204-pin
- frequency 1600 MHz
- CAS Latency (CL): 11
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Brief specs
- 1 module DDR memory
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