Team Group
Memory modules
Team Group TEDD2048M533HC4DC
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Team Group TEDD2048M533HC4DC
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Workmanship
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Technical characteristics and specs
General characteristics Memory type: DDR2; Form factor: DIMM 240-pin; Clock frequency: 533 MHz; Bandwidth: 4200 MB/s; Volume: 2 x 1 GB; ECC support: no; UN-Buffered Memory (Registered): no; Low Profile Bracket (Low Profile): no; Timings CAS Latency (CL): 4; RAS to CAS Delay (tRCD): 4; Row Precharge Delay (tRP): 4; Activate to Precharge Delay (tRAS): 12; Additionally The number of chips of each module: 16, two-way packaging; Supply voltage: 1.8 In; Radiator: yes;
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Popular today
| | - 1 DDR2 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- CAS Latency (CL): 6
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| | - 2 module DDR2 memory
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- radiator for additional cooling
- CAS Latency (CL): 5
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| | - 6 DDR3
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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Similar Memory modules
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- the frequency of 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 2 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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