Team Group
Memory modules
Team Group TMD34G1333HC9-S01
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Team Group TMD34G1333HC9-S01
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Tech characteristics and specifications
General characteristics Memory type: DDR3; Form factor: SODIMM 204-pin; Clock frequency: 1333 MHz; Bandwidth: 10600 MB/s; Volume: 1 module 4 GB; ECC support: no; Buffered (Registered): no; Low Profile (Low Profile): no; Timings CAS Latency (CL): 9; Additionally Supply voltage: 1.5 In; Radiator: yes;
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Team Group TMD34G1333HC9-S01 pictures
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Popular today
| | - 1 DDR2 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- CAS Latency (CL): 6
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| | - 2 module DDR2 memory
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- radiator for additional cooling
- CAS Latency (CL): 5
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| | - 6 DDR3
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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Similar Memory modules
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- the frequency of 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 2 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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