Team Group
Memory modules
Team Group TSDR512M400C3-E
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Team Group TSDR512M400C3-E
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Workmanship
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Technical specs and characteristics
General characteristics Memory type: DDR; Form factor: SODIMM 200-pin; Clock frequency: 400 MHz; Bandwidth: 3200 MB/s; Volume: 1 module 512 MB; ECC support: no; UN-Buffered Memory (Registered): no; Low Profile Bracket (Low Profile): no; Timings CAS Latency (CL): 3; RAS to CAS Delay (tRCD): 4; Row Precharge Delay (tRP): 4; Activate to Precharge Delay (tRAS): 8; Additionally Supply voltage: 2.6 In;
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Popular today
| | - 1 DDR2 memory module
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- CAS Latency (CL): 6
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| | - 2 module DDR2 memory
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 800 MHz
- radiator for additional cooling
- CAS Latency (CL): 5
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| | - 6 DDR3
- the volume of module 4 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 9
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- the frequency of 1333 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 1 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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Brief specs
- 2 of the DDR3
- the volume of module 2 GB
- form factor DIMM 240-pin
- frequency 1600 MHz
- radiator for additional cooling
- CAS Latency (CL): 7
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